Method and apparatus for indirect planarization
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United States of America Patent
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Jun 29, 2010
Grant Date -
Apr 3, 2008
app pub date -
Sep 29, 2006
filing date -
Sep 29, 2006
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Methods and apparatus for indirect planarization of a substrate are provided herein. In one embodiment, an apparatus for indirectly planarizing a probe card assembly includes an adjustment portion for controlling a force applied to a probe substrate of the probe card assembly; a force application portion configured to apply the force to the probe substrate at a location that is laterally offset from the adjustment portion; and a mechanism coupling the adjustment portion to the force application portion.
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