MEMS devices and processes for packaging such devices
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United States of America Patent
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Jun 29, 2010
Grant Date -
Oct 18, 2007
app pub date -
Apr 12, 2007
filing date -
Apr 13, 2006
priority date (Note) -
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status (Latency Note)
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Abstract
A package structure and method of packaging for a MEMS device is described. A transparent substrate having an interferometric modulator array formed thereon is shown. A single or dual-layered backplate is joined to the transparent substrate with a seal. The interferometric modulator array may be exposed to the surrounding environment through an opening in either the backplate or the seal.
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