MEMS sensor suite on a chip

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United States of America Patent

PATENT NO 7748272
SERIAL NO

12051905

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The MEMS Sensor Suite on a Chip provides the capability, monolithically integrated onto one MEMS chip, to sense temperature, humidity, and two axes of acceleration. The device incorporates a MEMS accelerometer, a MEMS humidity sensor, and a MEMS temperature sensor on one chip. These individual devices incorporate proof masses, suspensions, humidity sensitive capacitors, and temperature sensitive resistors (thermistors) all fabricated in a common fabrication process that allows them to be integrated onto one micromachined chip. The device can be fabricated in a simple micromachining process that allows its size to be miniaturized for embedded and portable applications. During operation, the sensor suite chip monitors temperature levels, humidity levels, and acceleration levels in two axes. External circuitry allows sensor readout, range selection, and signal processing.

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Patent Owner(s)

  • MORGAN RESEARCH CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Elliot, Robert Faye Madison, US 1 26
Kranz, Michael Scott Madison, US 7 215
Reiner, Philip John Huntsville, US 4 70
Whitley, Michael Ray Madison, US 2 64
Williams, Marty Ray Huntsville, US 3 80

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