Technique for increasing the compliance of tin-indium solders
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United States of America Patent
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Jul 6, 2010
Grant Date -
Mar 1, 2007
app pub date -
Feb 24, 2006
filing date -
Aug 30, 2005
priority date (Note) -
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Abstract
A technique for increasing the compliance of tin-indium solders is disclosed. In one particular exemplary embodiment, the technique may be realized as a lead free solder alloy comprising from about 58.0% to about 99.998% by weight tin, from about 0.001% to about 40.0% by weight indium, and from about 0.001% to about 2.0% by weight at least one rare earth element.
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