Blind via capture pad structure

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United States of America Patent

PATENT NO 7750250
SERIAL NO

11615467

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Abstract

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A capture pad structure includes a lower dielectric layer, a capture pad embedded within the lower dielectric layer, the capture pad comprising a plurality of linear segments. To form the capture pad, a focused laser beam is moved linearly to form linear channels in the dielectric layer. These channels are filled with an electrically conductive material to form the capture pad.

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Patent Owner(s)

Patent OwnerAddress
AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTDVALLEY POINT #12-03

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kuo, Bob Shih-Wei Tucson, US 21 396

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