IC package structures having separate circuit interconnection structures and assemblies constructed thereof
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United States of America Patent
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Jul 6, 2010
Grant Date -
May 4, 2006
app pub date -
Jul 14, 2005
filing date -
Apr 29, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
Disclosed are IC package structures comprised of standard IC packages modified with separate circuit interconnection structures and disposed to interconnect either directly to other IC packages or to intermediate pedestal connectors which serve to support and interconnect various circuit elements, thus effectively allowing critical signals to bypass the generally less capable interconnection paths within standard interconnection substrates.
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