Same size die stacked package having through-hole vias formed in organic material
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United States of America Patent
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Jul 6, 2010
Grant Date -
Nov 6, 2008
app pub date -
Jun 26, 2007
filing date -
May 4, 2007
priority date (Note) -
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Abstract
A semiconductor package includes a substrate or leadframe structure. A plurality of interconnected dies, each incorporating a plurality of through-hole vias (THVs) disposed along peripheral surfaces of the plurality of dies, are disposed over the substrate or leadframe structure. The plurality of THVs are coupled to a plurality of bond pads through a plurality of a metal traces. A top surface of a first THV is coupled to a bottom surface of a second THV. An encapsulant is formed over a portion of the substrate or leadframe structure and the plurality of dies.
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