Integrated circuit package system including zero fillet resin
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United States of America Patent
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Jul 6, 2010
Grant Date -
Aug 9, 2007
app pub date -
Feb 9, 2006
filing date -
Feb 9, 2006
priority date (Note) -
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Abstract
An integrated circuit packaging system comprised by providing a substrate with a first surface including conductive regions for receiving a flip chip die and a second surface including electrical contacts for external electrical connections. Providing the flip chip die over the substrate. Depositing a controlled volume of resin between the first surface of the substrate and the flip chip die and adhering the flip chip die to the first surface of the substrate to form the controlled volume of resin into a zero fillet resin.
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