Metal-metal bonding of compliant interconnect

United States of America Patent

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Jul 6, 2010
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Feb 16, 2006
app pub date
Aug 11, 2004
filing date
Aug 11, 2004

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Abstract

Embodiments of the invention provide a first component with a compliant interconnect bonded to a second component with a land pad by a metal to metal bond. In some embodiments, the first component may be a microprocessor die and the second component a package substrate.

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Patent Owner	Address
INTEL CORPORATION	2200 MISSION COLLEGE BOULEVARD SANTA CLARA CA 95054

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H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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Inventor Name	Address	# of filed Patents	Total Citations
Muthukumar, Sriram	Chandler, US	42	634
Ramanathan, Shriram	Portland, US	73	2588

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Metal-metal bonding of compliant interconnect

Number of patents in Portfolio can not be more than 2000

United States of America Patent

10917041

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PATENT NO	7750487
APP PUB NO	20060033172A1
SERIAL NO	10917041
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
July 06, 2010	US,7750487,B2 US7750487B2	GRANTED PATENT AS SECOND PUBLICATION
February 16, 2006	US,20060033172,A1 US20060033172A1	FIRST PUBLISHED PATENT APPLICATION

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10917041

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