Calibration of non-vibrating contact potential difference measurements to detect surface variations that are perpendicular to the direction of sensor motion
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United States of America Patent
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Jul 6, 2010
Grant Date -
Nov 5, 2009
app pub date -
May 2, 2008
filing date -
May 2, 2008
priority date (Note) -
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Abstract
A method and system for determining the contact potential difference of a wafer surface using a non-vibrating contact potential difference probe and a vibrating contact potential difference probe. The method and system involves scanning the wafer surface with a non-vibrating contact potential difference sensor, integrating and scaling the resulting data, and applying offsets to individual tracks of data to match the integrated scaled data to measurements made using a vibrating contact potential difference sensor.
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