Method of fabricating an embedded circuit pattern
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United States of America Patent
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Jul 13, 2010
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N/A
app pub date -
Jan 9, 2007
filing date -
Jan 9, 2007
priority date (Note) -
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Abstract
A method of fabricating a substrate includes forming a first conductive layer on a dielectric layer, forming a resist layer on the first conductive layer, and forming laser-ablated artifacts through the first resist layer, through the first conductive layer, and at least partially into the dielectric layer. A second conductive layer is formed within the laser-ablated artifacts. The laser-ablated artifacts are filled to form an overfilled circuit pattern. The resist layer and the first conductive layer are removed. Further, a portion of the overfilled circuit pattern is removed to form an embedded circuit pattern embedded within the dielectric layer.
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