US Patent No: 7,752,852

Number of patents in Portfolio can not be more than 2000

Vapor compression circuit and method including a thermoelectric device

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ALSO PUBLISHED AS: 20070101739
ATTORNEY / AGENT: (SPONSORED)
 

Importance

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Abstract

A system and method includes a thermoelectric device in heat-transfer relation with a working fluid flowing through a vapor compression circuit. Heat is transferred from the working fluid to a first fluid medium and then from the first fluid medium to a second fluid medium.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
EMERSON CLIMATE TECHNOLOGIES, INC.SIDNEY, OH328

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Akei, Masao Miamisburg, OH 36 91
Caillat, Jean-Luc M Dayton, OH 64 951
Ignatiev, Kirill M Sidney, OH 13 32
Jayanth, Nagaraj Sidney, OH 62 480
Pham, Hung M Dayton, OH 72 520

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