Wafer polishing apparatus and wafer polishing method
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United States of America Patent
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Jul 13, 2010
Grant Date -
Jul 12, 2007
app pub date -
Nov 17, 2006
filing date -
Nov 24, 2005
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The present invention provides a wafer polishing apparatus, comprising: a polishing pad to which a polishing liquid is supplied for polishing a wafer; a carrier head to carry the wafer; and one or more polishing liquid supplying device which supplies the polishing liquid onto the polishing pad, wherein the polishing liquid supplying device has a polishing liquid supplying member which is positioned close to or in contact with the polishing pad, and is relatively moved against the polishing pad, so that the polishing liquid supplied to the upper portion of the polishing liquid supplying member flows down along the polishing liquid supplying member to be painted on a surface of the polishing pad.
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