Printed circuits and method for making same
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United States of America Patent
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Jul 13, 2010
Grant Date -
Nov 27, 2008
app pub date -
May 21, 2007
filing date -
May 21, 2007
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for making printed circuits and printed circuit boards which includes coating a non-metallized substrate and plating an image of a desired circuit design directly onto the coated substrate without the need to image the circuit design on an intermediate silver halide polyester film or diazo and utilizing existing imaging, developing and etching subtractive techniques in conventional printed circuit board processing.
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