Method of manufacturing a semiconductor device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 13, 2010
Grant Date -
Mar 4, 2010
app pub date -
Aug 28, 2008
filing date -
Aug 28, 2008
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of manufacturing a semiconductor device. One embodiment provides a carrier. A semiconductor chip is provided with a first face and a second face opposite to the first face. The semiconductor chip is placed over the carrier with the first face facing the carrier. A voltage is applied between the second face of the semiconductor chip and the carrier for attaching the semiconductor chip to the carrier.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully