Multi-stack chip package with wired bonded chips
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United States of America Patent
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Jul 13, 2010
Grant Date -
May 10, 2007
app pub date -
Nov 2, 2006
filing date -
Nov 10, 2005
priority date (Note) -
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Abstract
A stack-type semiconductor device according to the present invention includes a circuit board with bonding pads; a first semiconductor chip which includes first electrode pads and is mounted on the circuit board; a second semiconductor chip which includes second electrode pads and is mounted on the first semiconductor chip; a plurality of bonding wires sequentially connecting the bonding pads, the first electrodes and the second electrodes as a whole; and a sealing resin for sealing the first semiconductor chip, the second semiconductor chip and the bonding wires.
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