Stacked die module including multiple adhesives that cure at different temperatures
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United States of America Patent
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Jul 13, 2010
Grant Date -
Mar 25, 2004
app pub date -
Sep 25, 2003
filing date -
May 8, 2002
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A technique for forming die stacks. Specifically, a stacking tip is provided to facilitate the stacking of die in a desired configuration. A first die is picked up by the stacking tip. The first die is coated with an adhesive on the underside of the die. The first die is brought in contact with a second die via the stacking tip. The second die is coupled to the first die via the adhesive on the underside of the first die. The second die is coated with an adhesive coating on the underside of the die. The second die is then brought in contact with a third die via the stacking tip. The third die is coupled to the second die via the adhesive on the underside of the second die, and so forth. Die stacks are formed without being coupled to a substrate. The die stacks may be functionally and/or environmentally tested before attaching the die stack to a substrate.
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