Method and system for generating implementation files from a high level specification
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United States of America Patent
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Jul 13, 2010
Grant Date -
N/A
app pub date -
Sep 19, 2007
filing date -
Oct 15, 2004
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Abstract
A method and system for generating implementation files from a high level specification are described. In one example, a method for creating a package file for an integrated circuit is described. First, a grid is formed having a plurality of blocks. A height and a width are then determined for each block. At least one bump is placed on a block and a corresponding package pin is assigned to the at least one bump. Finally, the package file is output.
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