Modified core for circuit module system and method
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United States of America Patent
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Jul 20, 2010
Grant Date -
Sep 7, 2006
app pub date -
Apr 3, 2006
filing date -
Sep 3, 2004
priority date (Note) -
In Force
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Abstract
Flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of its major sides. The populated flexible circuitry is disposed proximal to a rigid substrate to place the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The rigid substrate exhibits adhesion features that allow more advantageous use of thermoplastic adhesives with concomitant rework advantages and while providing flexibility in meeting dimensional specifications such as those promulgated by JEDEC, for example.
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