Method of assembling a wafer probe

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7761983
APP PUB NO 20080045028A1
SERIAL NO

11975244

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention relates to a method of assembling a probe for testing of integrated circuits or other microelectronic devices.

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Patent Owner(s)

  • CASCADE MICROTECH, INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Andrews, Mike Hillsboro, US 61 1543
Hayden, Leonard Beaverton, US 26 484
Martin, John Portland, US 225 6142

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