Semiconductor device package with multi-chips and method of the same
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United States of America Patent
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Jul 27, 2010
Grant Date -
Nov 6, 2008
app pub date -
Jul 9, 2008
filing date -
Feb 16, 2007
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention provides a semiconductor device package with the multi-chips comprising a substrate with at least a die receiving through hole, connecting through holes structure and first contact pads on an upper surface and second contact pads on a lower surface of the substrate. At least a first die having first bonding pads is disposed within the die receiving through hole. A first adhesion material is formed under the die and a second adhesion material is filled in the gap between the die and sidewall of the die receiving though hole of the substrate. Then, a first bonding wire is formed to couple the first bonding pads and the first contact pads. Further, at least a second die having second bonding pads is placed on the first die. A second bonding wire is formed to couple to the second bonding pads and the first contact pads. A dielectric layer is formed on the first and second bonding wire, the first and second die and the substrate.
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