Resin molded semiconductor device and differential amplifier circuit

United States of America Patent

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Jul 27, 2010
Grant Date
Sep 11, 2008
app pub date
Mar 5, 2008
filing date
Mar 6, 2007

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Expired

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Patent Owner(s)

Patent Owner	Address
RENESAS ELECTRONICS CORPORATION	TOKYO 135-0061

International Classification(s)

H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Arakawa, Hideyuki	Tokyo, JP	13	328
Fukudome, Katsuyuki	Tokyo, JP	5	289
Hatauchi, Kazushi	Tokyo, JP	10	94
Misumi, Kazuyuki	Tokyo, JP	13	165
Takata, Yasuki	Tokyo, JP	6	29
Yasuda, Naoya	Tokyo, JP	6	50

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Resin molded semiconductor device and differential amplifier circuit

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United States of America Patent

12073384

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PATENT NO	7763966
APP PUB NO	20080217750A1
SERIAL NO	12073384
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity Expired	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
July 27, 2010	US,7763966,B2 US7763966B2	GRANTED PATENT AS SECOND PUBLICATION
September 11, 2008	US,20080217750,A1 US20080217750A1	FIRST PUBLISHED PATENT APPLICATION

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12073384

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