High performance probe system
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United States of America Patent
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-
Jul 27, 2010
Grant Date -
May 28, 2009
app pub date -
Oct 28, 2008
filing date -
May 8, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A probe system for providing signal paths between an integrated circuit (IC) tester and input/output, power and ground pads on the surfaces of ICs to be tested includes a probe board assembly, a flex cable and a set of probes arranged to contact the IC's I/O pads. The probe board assembly includes one or more rigid substrate layers with traces and vias formed on or within the substrate layers providing relatively low bandwidth signal paths linking the tester to probes accessing some of the IC's pads. The flex cable provides relatively high bandwidth signal paths linking the tester to probes accessing others of the IC's pads.
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