US Patent No: 7,767,498

Number of patents in Portfolio can not be more than 2000

Encapsulated devices and method of making

ALSO PUBLISHED AS: 20070049155

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Abstract

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A method of encapsulating an environmentally sensitive device. The method includes providing a substrate; placing at least one environmentally sensitive device adjacent to the substrate; and depositing at least one barrier stack adjacent to the environmentally sensitive device, the at least one barrier stack comprising at least one barrier layer and at least one polymeric decoupling layer, wherein the at least one polymeric decoupling layer is made from at least one polymer precursor, and wherein the polymeric decoupling layer has at least one of: a reduced number of polar regions; a high packing density; a reduced number of regions that have bond energies weaker than a C—C covalent bond; a reduced number of ester moieties; increased Mw of the at least one polymer precursor; increased chain length of the at least one polymer precursor; or reduced conversion of C═C bonds. An encapsulated environmentally sensitive device is also described.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
SAMSUNG DISPLAY CO., LTD.SUWON-SI GYEONGGI-DO8528

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Krajewski, Todd L Mountainview, CA 2 10
Moro, Lorenza Palo Alto, CA 32 74

Cited Art Landscape

Patent Info (Count) # Cites Year
 
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Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00