System for fabricating semiconductor components with conductive interconnects
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United States of America Patent
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Aug 3, 2010
Grant Date -
Sep 25, 2008
app pub date -
May 3, 2008
filing date -
May 19, 2005
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Abstract
A system for fabricating semiconductor components includes a semiconductor substrate, a thinning system for thinning the semiconductor substrate, an etching system for forming the substrate opening, and a bonding system for bonding the conductive interconnect to the substrate contact. The semiconductor component can be used to form module components, underfilled components, stacked components, and image sensor semiconductor components.
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