Multi-chip package system

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7768125
APP PUB NO 20070158809A1
SERIAL NO

11326211

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A chip package system is provided including providing a chip having interconnects provided thereon; forming a molding compound on the chip and encapsulating the interconnects; and forming a recess in the molding compound above the interconnects to expose the interconnects.

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Patent Owner(s)

Patent OwnerAddress
STATS CHIPPAC PTE LTD5 YISHUN STREET 23 SINGAPORE 768442

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chow, Seng Guan Singapore, SG 216 7432
Kuan, Heap Hoe Singapore, SG 149 4380

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