Die module system
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United States of America Patent
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Aug 3, 2010
Grant Date -
Nov 13, 2008
app pub date -
Jun 26, 2008
filing date -
Sep 3, 2004
priority date (Note) -
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status (Latency Note)
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Abstract
A flex circuit is populated on one or both sides with plural integrated circuit die. In a preferred mode, the flex circuit is populated with flip-chip die. One side of the flex circuit has a connective facility implemented in a preferred mode with edge connector contacts. The flex circuit is disposed about a substrate to form a circuit module that may be inserted into an edge connector such as ones typically found on a computer board.
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