Chemical mechanical polishing slurries, their applications and method of use thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 17, 2010
Grant Date -
Aug 14, 2008
app pub date -
Apr 19, 2006
filing date -
Apr 21, 2005
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
This invention disclosed a chemical mechanical polishing slurry, which includes at least one abrasive particle, an oxidant and a carrier. The oxidant is combined with a big metallorganic compound; and the applications and corresponding handling method are also disclosed. This invention slurry can realize high removal rate, no corrosion, low defectivity and high plan.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully