Underfilling with acid-cleavable acetal and ketal epoxy oligomers

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United States of America Patent

PATENT NO 7776993
APP PUB NO 20050250248A1
SERIAL NO

11154794

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Abstract

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A reworkable thermoset epoxy-containing material that allows for a reworkable assembly such as a reworkable waferlevel underfilled microelectronic package. A method for using the reworkable thermoset material in the formation of a microelectronic package using this material.

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Patent Owner(s)

Patent OwnerAddress
GLOBALFOUNDRIES INCGRAND CAYMAN CAYMAN ISLANDS

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Buchwalter, Stephen Leslie Hopewell Junction, US 24 325
Feger, Claudius Poughkeepsie, US 61 1307
Hougham, Gareth Ossining, US 23 230
LaBianca, Nancy Yalesville, US 5 39
Shobha, Hosadurga Yorktown Heights, US 109 510

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