Power core devices and methods of making thereof
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United States of America Patent
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Aug 17, 2010
Grant Date -
Jun 22, 2006
app pub date -
Nov 30, 2005
filing date -
Dec 21, 2004
priority date (Note) -
In Force
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Abstract
The present invention relates to a power core comprising: at least one embedded surface mount technology (SMT) discrete chip capacitor layer comprising at least one embedded SMT discrete chip capacitor; and at least one planar capacitor laminate; wherein at least one planar capacitor laminate serves as a low inductance path to supply a charge to at least one embedded SMT discrete chip capacitor; and wherein said embedded SMT discrete chip capacitor is connected in parallel to said planar capacitor laminate.
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