Wireless sensor for semiconductor processing systems
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United States of America Patent
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Aug 17, 2010
Grant Date -
Sep 18, 2008
app pub date -
Mar 11, 2008
filing date -
Mar 12, 2007
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A wireless sensor is provided to obtain information relating to vibration of wafers or substrates in a semiconductor processing system. In one exemplary embodiment, a wireless substrate-like sensor is provided and includes a power source adapted to provide power to the sensor, a wireless communication module coupled to the power source, and a controller coupled to the power source and the wireless communication module. An acceleration detection component is operably coupled to the controller to provide information relative to acceleration of the sensor in three axes.
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