Method for forming a MEMS

United States of America Patent

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Aug 24, 2010
Grant Date
Nov 8, 2007
app pub date
May 3, 2007
filing date
May 5, 2006

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Abstract

Techniques are described for forming actuators having piezoelectric material. A block of piezoelectric material is bonded to a transfer substrate. The block is then polished. The polished surface is bonded to a MEMS body.

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Patent Owner	Address
FUJIFILM DIMATIX INC	109 ETNA ROAD LEBANON NH 03766

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H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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Inventor Name	Address	# of filed Patents	Total Citations
Birkmeyer, Jeffrey	San Jose, US	37	470
Chen, Zhenfang	Cupertino, US	26	191

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Method for forming a MEMS

Number of patents in Portfolio can not be more than 2000

United States of America Patent

11744124

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PATENT NO	7779522
APP PUB NO	20070259468A1
SERIAL NO	11744124
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
August 24, 2010	US,7779522,B2 US7779522B2	GRANTED PATENT AS SECOND PUBLICATION
November 08, 2007	US,20070259468,A1 US20070259468A1	FIRST PUBLISHED PATENT APPLICATION

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11744124

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