Arrangement of at least one power semiconductor module and a printed circuit board
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United States of America Patent
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-
Aug 24, 2010
Grant Date -
Nov 27, 2008
app pub date -
Mar 26, 2008
filing date -
Mar 28, 2007
priority date (Note) -
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status (Latency Note)
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Abstract
An arrangement between a power semiconductor module and a printed circuit board is disclosed, A printed circuit board includes strip conductors, and a power semiconductor module includes a module housing and power terminals. The power terminals extend to the exterior of the module housing and into contact with the strip conductors. A heat sink is disposed on a side of the power semiconductor module opposite the circuit board. A deformable means is disposed between the module housing and the circuit board and is configured to relieve a contact pressure load on the power terminals. A contact-pressure element is disposed on a side of the circuit board opposite the power semiconductor module. The contact-pressure element is integral with a first housing part of an arrangement housing, and the heat sink is integral with a second housing part of the arrangement housing. The two housing parts enclose the circuit board.
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