DISK DRIVE SUSPENSION VIA FORMATION USING A TIE LAYER AND PRODUCT

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20100230144A1
SERIAL NO

11340298

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Abstract

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A disk drive suspension interconnect, and method therefor. The interconnect has a metal grounding layer, a metal conductive layer and an insulative layer between the metal grounding layer and the conductive metal layer. A circuit component such as a slider is electrically connected to the conductive layer along a grounding path from the circuit component and the conductive layer to the metal grounding layer through an aperture in the insulative layer. For improved electrical connection a tie layer is provided through the insulative layer onto the grounding layer in bonding relation with the ground layer. A conductor is deposited onto both the conductive metal layer and the tie layer in conductive metal layer and tie layer bonding relation, and the circuit component is thus bonded to the grounding layer by the conductor.

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Patent Owner(s)

Patent OwnerAddress
HUTCHINSON TECHNOLOGY INCORPORATED40 WEST HIGHLAND PARK DRIVE NE HUTCHINSON MN 55350

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dunn, Christopher Temecula, US 32 542
Schreiber, Christopher Temecula, US 15 314

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