Electronic chip contact structure

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7781886
APP PUB NO 20060278981A1
SERIAL NO

11329885

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A chip contact functionally having an IC pad, a barrier layer over the IC pad, and a malleable material over the barrier layer. An alternative chip contact functionally having an IC pad, a barrier layer over the IC pad, and a rigid material over the barrier layer.

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Patent Owner(s)

  • CUFER ASSET LTD. L.L.C.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Callahan, John 99 Salem St. 32 1750
Dudoff, Gregory 28 Standish Way 10 478
Trezza, John 12 White Oak Dr. 102 2625

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