Method and apparatus for chemical mechanical polishing
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United States of America Patent
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Aug 31, 2010
Grant Date -
Sep 22, 2005
app pub date -
May 20, 2005
filing date -
May 17, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A polishing device is hermetically accommodated in a chamber containing an atmosphere having a composition different from the ambient air, so that the atmosphere around the polishing device is altered into the composition different from the ambient air, and voltage is applied between a wafer and a polishing pad to polish the wafer with an electrolytic effect. The polishing device has the atmosphere containing extremely less oxygen, preventing a surface of the wafer from oxidation and thereby providing a constant polishing rate.
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