Chip-based thermo-stack

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7785931
APP PUB NO 20090269888A1
SERIAL NO

12483609

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A chip unit has a stack of at least two electronic chips stacked one on top of the other, a through-chip connection within the stack, the through-chip connection including a bounding material having an inner and outer perimeter, the inner perimeter defining an interior volume longitudinally extending through at least one of the at least two chips and at least partially into another of the at least two chips so as to form a tube extending between the one and the other of the chips, and an amount of working fluid hermetically sealed within the tube, the working fluid having a volume and being at a pressure such that the working fluid and tube will operate as a heat pipe and transfer heat from the stack of chips to the working fluid.

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Patent Owner(s)

  • CUFER ASSET LTD. L.L.C.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Trezza, John 12 White Oak Dr. 102 2623

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