Cyanate-terminated polyphenylene ether
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United States of America Patent
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Aug 31, 2010
Grant Date -
Feb 25, 2010
app pub date -
Oct 30, 2009
filing date -
Jan 28, 2002
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Abstract
The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.
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