Importance

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Abstract

The invention relates to a contact arrangement for a measuring probe or a measuring head for measuring high frequency, especially on a semiconductor wafer. The arrangement comprises a contact end for electrically contacting planar structures. A coplanar conductor structure having at lease two conductors carried by a dielectric is provided at the contact end. Between the dielectric and the contact end, the measuring tip is configured in such a manner that the conductors of the coplanar conductor structure are disposed in mid-air and in a resilient manner in relation to the dielectric retaining them. The invention is characterized in that the dielectric is provided with at least one arrangement for transmitting electrical signals, the arrangement being electrically connected to at least one conductor of the conductor structure in such a manner that the arrangement transmits signals from the at least one conductor that is electrically connected to the arrangement.

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First Claim