Optical devices with multiple wafers containing planar optical waveguides
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United States of America Patent
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Sep 7, 2010
Grant Date -
Apr 9, 2009
app pub date -
Sep 5, 2008
filing date -
Sep 5, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for fabricating an optical device wherein the device comprises a first substrate wafer with at least one buried optical waveguide on an approximately flat planar surface of the substrate and a second substrate wafer with at least a second buried optical waveguide. The waveguides so formed may be straight or curved along the surface of the wafer or curved by burying the waveguide at varying depth along its length. The second wafer is turned (flipped) and bonded to the first wafer in such a manner that the waveguides, for example, may form an optical coupler or may cross over one another and be in proximate relationship along a region of each. As a result, three-dimensional optical devices are formed avoiding the convention techniques of layering on a single substrate wafer.
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