Thermal and coductivity sensing systems, devices and methods
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United States of America Patent
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Sep 14, 2010
Grant Date -
Nov 1, 2007
app pub date -
Apr 13, 2007
filing date -
Apr 14, 2006
priority date (Note) -
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status (Latency Note)
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Abstract
A sensing probe is described. The sensing probe includes a probe housing having a probe tip. A thermal sensor in the housing is also included. The thermal sensor has a sensing end and a connector end, where the sensing end is thermally coupled to the probe tip. Also included are at least two leads. The leads transfer electrical signals that are used to determine temperature and conductivity. Also included is a thermal well. The thermal well includes a hollow housing of a thermally conductive material. The housing has an outer surface and an inner surface. The inner surface is a predetermined shape so as to form a mating relationship with a sensing probe. The mating thermally couples the inner surface with a sensing probe. In some embodiments, the thermal well is located on a disposable portion and the sensing probe on a reusable portion.
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