Multi-station deposition apparatus and method
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United States of America Patent
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Sep 14, 2010
Grant Date -
Aug 27, 2009
app pub date -
May 5, 2009
filing date -
Apr 16, 2002
priority date (Note) -
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Abstract
A multi-station deposition apparatus capable of simultaneous processing multiple substrates using a plurality of stations, where a gas curtain separates the stations. The apparatus further comprises a multi-station platen that supports a plurality of wafers and rotates the wafers into specific deposition positions at which deposition gases are supplied to the wafers. The deposition gases may be supplied to the wafer through single zone or multi-zone gas dispensing nozzles.
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