Method of creating MEMS device cavities by a non-etching process

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United States of America Patent

PATENT NO 7795061
SERIAL NO

11321134

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Abstract

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MEMS devices (such as interferometric modulators) may be fabricated using a sacrificial layer that contains a heat vaporizable polymer to form a gap between a moveable layer and a substrate. One embodiment provides a method of making a MEMS device that includes depositing a polymer layer over a substrate, forming an electrically conductive layer over the polymer layer, and vaporizing at least a portion of the polymer layer to form a cavity between the substrate and the electrically conductive layer. Another embodiment provides a method for making an interferometric modulator that includes providing a substrate, depositing a first electrically conductive material over at least a portion of the substrate, depositing a sacrificial material over at least a portion of the first electrically conductive material, depositing an insulator over the substrate and adjacent to the sacrificial material to form a support structure, and depositing a second electrically conductive material over at least a portion of the sacrificial material, the sacrificial material being removable by heat-vaporization to thereby form a cavity between the first electrically conductive layer and the second electrically conductive layer.

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Patent Owner(s)

Patent OwnerAddress
SNAPTRACK INC5775 MOREHOUSE DR SAN DIEGO CA 92121

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lan, Jeffrey Cupertino, US 2 28
Sasagawa, Teruo Los Gatos, US 71 1450
Wang, Chun-Ming Fremont, US 55 1130

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