Method, system, and apparatus for transfer of dies using a die plate having die cavities
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United States of America Patent
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Sep 14, 2010
Grant Date -
Jan 13, 2005
app pub date -
Jun 14, 2004
filing date -
Jun 12, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
A method, system, and apparatus for transfer of dies using a die plate having die cavities is described herein. The die plate has a planar body. The body has a plurality of cells or cavities which are open at the first surface of the body. Each cell has a hole extending from the bottom surface of the cell to a second surface of the body. A wafer or support structure can be positioned to be closely adjacent to each other. A suction can be applied to the second surface of the die plate so that a plurality of dies can be transferred into a plurality of cells of the die plate. The dies can subsequently be transferred from the die plate having die cavities to one or more destination substrates or surfaces, by a punching mechanism.
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