Flip chip type LED lighting device manufacturing method
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United States of America Patent
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Sep 14, 2010
Grant Date -
Jan 3, 2008
app pub date -
Sep 6, 2007
filing date -
Nov 5, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A flip chip type LED lighting device manufacturing method includes the step of providing a strip, the step of providing a submount, the step of forming a metal bonding layer on the strip or submount, the step of bonding the submount to the strip, and the step of cutting the structure thus obtained into individual flip chip type LED lighting devices.
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