Electronic component
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United States of America Patent
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Sep 14, 2010
Grant Date -
Oct 20, 2005
app pub date -
May 7, 2003
filing date -
Jun 25, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
An electronic component includes a multi-layer substrate having an upper side and under side, and at least one integrated impedance converter. The electronic component also includes at least one chip component having external contacts. The at least one chip component is disposed on the upper side of the multi-layer substrate, and is electrically connected to the at least one integrated impedance converter.
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