Microelectronic contact structures
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United States of America Patent
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-
Sep 21, 2010
Grant Date -
Nov 19, 2009
app pub date -
Jul 28, 2009
filing date -
Feb 13, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Microelectronic contact structures are fabricated by separately forming, then joining together, various components thereof. Each contact structure has three components: a “post” component, a “beam” component, and a “tip” component. The resulting contact structure, mounted to an electronic component, is useful for making an electrical connection with another electronic component. The post component can be fabricated on a sacrificial substrate, joined to the electronic component and its sacrificial substrate removed. Alternatively, the post component can be formed on the electronic component. The beam and tip components can each be fabricated on a sacrificial substrate. The beam component is joined to the post component and its sacrificial substrate is removed, and the tip component is joined to the beam component and its sacrificial substrate is removed.
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