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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

• KABUSHIKI KAISHA TOSHIBA

International Classification(s)

• B05D:PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MAT....

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Ema, Tatsuhiko	Kamakura, JP	23	144
Hayasaki, Kei	Kamakura, JP	38	256
Ito, Shinichi	Yokohama, JP	376	3661
Nakata, Rempei	Kamakura, JP	45	907
Okumura, Katsuya	Tokyo, JP	337	7835
Yamada, Nobuhide	Tokyo, JP	27	125

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent No: 7799368

Film forming method, film forming apparatus, pattern forming method, and manufacturing method of semiconductor apparatus

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