Microelectronic die including locking bump and method of making same
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United States of America Patent
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Sep 21, 2010
Issued Date -
N/A
app pub date -
Jun 11, 2007
filing date -
Jun 11, 2007
priority date (Note) -
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status (Latency Note)
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Abstract
A microelectronic die and a method of providing same. The die includes a die substrate having an active surfaces and a locking bump on the active surface of the die substrate. The locking bump defines a recess adapted to receive therein a solder bump of a package substrate such that an apex of the solder bump contacts a bottom of the recess.
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