Imprinting of partial fields at the edge of the wafer

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United States of America Patent

PATENT NO 7802978
APP PUB NO 20070228609A1
SERIAL NO

11694500

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Abstract

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The present invention is directed towards several aspects of imprint lithography that have to be improved to address imprinting of partial fields and dies at the edge of the wafer.

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Patent Owner(s)

Patent OwnerAddress
CITIBANK N A388 GREENWICH STREET NEW YORK NY 10013

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Choi, Byung-Jin Austin, US 194 2163
Sreenivasan, Sidlgata V Austin, US 214 5594

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